| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a piezoelectric device obtained by wire-bonding a substantially rectangular piezoelectric vibrating chip, in plan view. <P>SOLUTION: A piezoelectric vibrator 10 is constituted of a piezoelectric vibration chip 20, having a piezoelectric substrate on which a thin part 22 and a thick part 24 are formed; and a mounting substrate 50, on which the piezoelectric vibration chip 20 is mounted and a connection terminal 52 is formed, wherein an excitation electrode 26 is formed on the thin part 22. A connection electrode 28, electrically connected to the excitation electrode 26 is formed on the thick part 24; a deletion part 32, which is at least one of a notch part formed by partially notching a peripheral edge and a through-hole is formed on the piezoelectric substrate; and a portion of the connection terminal 52, which is exposed from the deletion part 32 in plan view, is connected to the connection electrode 28 by a wire 58. <P>COPYRIGHT: (C)2011,JPO&INPIT |
