发明名称 |
USE OF ENDPOINT SYSTEM TO MATCH INDIVIDUAL PROCESSING STATIONS WITHIN A TOOL |
摘要 |
A technique for processing a wafer (115) in a semiconductor manufacturing process (100) is disclosed. The method comprises first collecting a set of processing rate data from a multi-station processing tool (105), the set including process rate data from at least two stations (110) in the processing tool (105). The collected processing rate data is then communicated to a controller (145) that autonomously compares the processing rate data to determine whether to adjust a process parameter. The method then adjusts the process parameter for at least one station (110) to match the process endpoint for the at least one station (110). |
申请公布号 |
WO02054481(A3) |
申请公布日期 |
2003.08.07 |
申请号 |
WO2001US30776 |
申请日期 |
2001.10.02 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
PASADYN, ALEXANDER, J.;HEWETT, JOYCE, S., OEY |
分类号 |
H01L21/304;H01L21/02;H01L21/66 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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