| 摘要 |
PROBLEM TO BE SOLVED: To provide a polymerizable imide composition that can be used in a packaging field in which high stability upon heating is required, especially that can be suitably used when a composite material with an epoxy resin is produced. SOLUTION: In the polymerizable imide composition containing unsaturated imide and a polymerization catalyst, a phosphorus compound is required for the polymerization catalyst, and the phosphorus compound has a structure in which at least one element bonded to phosphorus element is negatively polarized. COPYRIGHT: (C)2011,JPO&INPIT |
