| 摘要 |
<P>PROBLEM TO BE SOLVED: To further improve throughput by at least performing measurement processing to wafers held by holding members and replacement of the wafers held by the holding members on supporting devices in parallel at least partially. <P>SOLUTION: A measurement station 300 performs measurement processing to the wafer W held by a slight movement stage WFS2 supported by a rough movement stage WCS2 and the replacement of the wafer W held by a rough movement stage WFS3 on a center table 130 in parallel at least partially, while an exposure station 200 performs exposure processing to the wafer W held by a slight movement stage WFS1 supported by a rough movement stage WCS1, thus achieving higher-throughput exposure than a conventional aligner for performing exposure processing to the wafer on one wafer stage, and processing, such as replacement of wafers on another wafer stage and alignment, in parallel. <P>COPYRIGHT: (C)2011,JPO&INPIT |
