CONTACT DEVICE OF CONTROL CONNECTION FOR POWER SEMICONDUCTOR COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a contact device of control connection for a power semiconductor component.

SOLUTION: A contact device 2 of control connection is for contacting to a control connection of a power semiconductor component 11 of a power semiconductor module 1. An insulating material body 20 is arranged away from the power semiconductor component 11 by a certain distance. A first recess 31 and a second recess 32 are provided which have at least one contact device 40 for control connection contacting to the power semiconductor component 11. The contact device 40 is intended to be arranged at the insulating material body 20. A pin-like projection 42 is provided which contacts to the power semiconductor component 11 by penetrating the first recess 31. A metal molding 50 is provided between the contact device 40 and a connection device 60. The connection device 60 is arranged parallel to the power semiconductor component 11 so that the connection device 60 may be inserted through the second recess 32 and may be connected to the metal molding 50 for electrical continuity.

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