| 摘要 |
<p>#CMT# #/CMT# Partial discharge resistant insulating lacquer comprises: a polyamide-imide-enamel lacquer and an organo-silica-sol that is dispersed in a solvent comprising 50-100 wt.% of gamma -butyrolactone. #CMT# : #/CMT# Independent claims are included for: (1) an insulated wire comprising a conductor, and a partial discharge resistant insulating cover film, which is formed on the surface of the conductor, where the partial discharge resistant insulating cover film is made of partial discharge resistant insulating lacquer; (2) the preparation of partial discharge resistant insulating lacquer; and (3) the preparation of the insulated wire comprising: preparing the partial discharge resistant insulating lacquer and coating the partial discharge resistant insulating lacquer on the surface of a conductor and then burning of the lacquer in order to form a cover film on the conductor. #CMT#USE : #/CMT# The partial discharge resistant insulating lacquer is used in insulating wires (claimed). #CMT#ADVANTAGE : #/CMT# The partial discharge resistant insulating lacquer exhibits: improved mechanical characteristic such as sliding quality and scratching resistance characteristics; long-term quality and stability. The partial discharge resistant insulating lacquer is reproducible. The organo-silica-sol exhibits an improved transparency. #CMT#ORGANIC CHEMISTRY : #/CMT# Preparation (Claimed): Preparation of the partial discharge resistant insulating lacquer comprises mixing polyamide-imide-enamel lacquer with the organo-silica-sol, where the polyamide-imide-enamel lacquer comprises gamma -butyrolactone as a main solvent that comprises organo-silica-sol gamma -butyrolactone as a main dispersion solvent. Preferred Components: The resin component of the polyamide enamel lacquer comprises an organo-silica-sol silica component (1-100 wt.parts per hundred parts of the resin). The organo-silica-sol exhibits an average particle size of 100 nm or smaller. The insulating wire further comprises: an organic insulating cover film, which is formed on the surface of the conductor or partial discharge resistant insulating cover film that is formed on the surface of the organic insulating cover film. The polyamide-imide-enamel lacquer comprises 60-100 wt.% of butyrolactone, based on the total quantity of a solvent. The organo-silica-sol comprises 80-100 wt.% of gamma -butyrolactone, based on the total quantity of the dispersion. Preferred Process: The preparation of the insulated wire further comprises: forming an organic insulating cover film on the surface of the conductor, where the partial discharge resistant insulating cover film is formed on the surface of the organic insulating cover film. #CMT#EXAMPLE : #/CMT# The polyamide-imide-enamel lacquer in 100% of gamma -butyrolactone was mixed with the organo-silica-sol in 100% of gamma -butyrolactone to give the partial discharge resistant insulating lacquer.</p> |
