| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of making fine-pitch circuit traces. SOLUTION: A method of making fine-pitch circuit traces includes the steps of: preparing an insulative substrate 10 and disposing a conductive metal layer 20 on the insulative substrate 10; disposing on a whole or a part of a top surface of the conductive metal layer 20, a hetero layer 30 having an etching rate smaller than that of the conductive metal layer 20; continuously forming a mask 40 having a circuit trace pattern on the hetero layer 30 and performing wet etching; and finally removing the mask 40 and the hetero layer 30 so as to form fine-pitch circuit traces having a high etching factor. COPYRIGHT: (C)2011,JPO&INPIT
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