| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board that can prevent the discoloration of the surface of a copper circuit plate used as a circuit pattern without rust proofing using a rust preventive agent formed of an organic substance or plating and improve solder wettability or weather resistance such as heat resistance or the like in a soldering step, and to provide a manufacturing method therefor.SOLUTION: The surface of a copper circuit plate joined to at least one surface of a ceramic board is degreased, washed by water, pickled, and washed by water again, and immersed in a Pd activation liquid at 20 to 40°C for 20 to 600 seconds to adhere Pd to the surface of the copper circuit board. The surface of the copper circuit board is washed by water, and then washed by a pure water of around 30 to 60°C and dried by a hot air of 40 to 70°C. |
