| 摘要 |
PROBLEM TO BE SOLVED: To reduce an error in a working shape in etching processing.SOLUTION: In a step in which surface processing is conducted by irradiating a plasma jet 31 from a plasma jet gun 1 to quartz glass 24, light emitting portion 32 produced by a reaction of the plasma jet 31 with the quartz glass 24 is imaged with a CCD video camera 27. A spectrum with a wavelength of light emitting portion 32 of 440 nm is detected, and a relative position of the plasma jet 31 and the quartz glass 24, an amount of removal, and a diameter of removal are controlled so as to reduce a difference between a shape after removal obtained from the emission intensity distribution, and a target shape after removal. |
