发明名称 METHOD FOR FORMING MICROSTRUCTURE, LASER IRRADIATION DEVICE, AND SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming microstructures formable of the microstructure such as a micro-pore and a micro-groove at a substantially constant etching speed, without affected by arrangement in a substrate, a laser irradiation device used in the forming method, and the substrate produced using the forming method. <P>SOLUTION: This method for forming the microstructure includes a process A of irradiating an area provided with the pore-like microstructure in the substrate 1, with a laser beam 51 having a pulse duration of picosecond order or less in a pulse time width, and scanning a focal point 56 converged with the laser beam 51, to form a modified part 53, and a process B of etching the substrate formed with the modified part 53, and for removing the modified part 53, to form the microstructure, and is constituted to emit the laser light, while maintaining a direction P of a linear polarization, in a fixed direction with respect to a direction of scanning the focal point 56, using the linearly polarized laser light as the laser light 51. in the process A. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011218398(A) 申请公布日期 2011.11.04
申请号 JP20100089509 申请日期 2010.04.08
申请人 FUJIKURA LTD 发明人 WAKIOKA HIROYUKI
分类号 B23K26/36;B23K26/00;B23K26/04;H01L23/15;H01L23/52;H05K3/00;H05K3/40 主分类号 B23K26/36
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