| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a terminal with a barrier portion having high effect of solder rising prevention, and to provide a manufacturing method thereof. <P>SOLUTION: This is a terminal having a barrier portion against solder rising 13, in which the percentages of detection intensities of Ni, Au and O on the surface of the barrier portion by the X-ray photoelectron spectroscopy (XPS) satisfies the relationship of 30%≥Ni/Au≥60% and 50%≥O/Au at a sputtering time=0. <P>COPYRIGHT: (C)2012,JPO&INPIT |
