| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of precisely performing temperature management and temperature control of the peripheral part and the central part of a substrate independently and simplifying a piping structure. <P>SOLUTION: A substrate processing apparatus for processing substrates in a vacuum processing space includes a substrate mounting table for mounting at least two substrates thereon. The substrate mounting table includes substrate mounting units whose number corresponds to the number of the substrates mounted on the substrate mounting table. Each of the substrate mounting units includes a central temperature control flow path for cooling a central portion of the substrates to be mounted and a peripheral temperature control flow path for cooling a peripheral portion of the substrates, and the central temperature control flow path and the peripheral temperature control flow path are formed independently of each other. The substrate mounting table includes one temperature control medium inlet port for introducing a temperature control medium into the peripheral temperature control flow path, and temperature control medium outlet ports for discharging the temperature control medium from the peripheral temperature control flow path. The number of the temperature control medium outlet ports corresponds to the number of substrates to be mounted. <P>COPYRIGHT: (C)2012,JPO&INPIT |
