| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a compact electronic unit structured so that a connection terminal of a flexible substrate and a connection terminal of a rigid substrate or a flexible substrate can have conduction for sure through an ACF. <P>SOLUTION: A first coverlay is disposed between plural first connection terminals arranged at predetermined intervals on a first print board including a rigid substrate or a flexible substrate. The first coverlay protrudes beyond a surface of the first connection terminal by a height of A. A second coverlay is disposed between plural second connection terminals arranged at predetermined intervals on a second print board including a flexible substrate. When the second coverlay protrudes beyond a surface of the second connection terminal by a height of B, a projection part with a height of A and B is provided for an area on a surface of a press-bonding head that is opposite to the second print board and that corresponds to the position of the second connection terminal, so that the projection part presses the second print board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
