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发明名称
用以测试积体电路元件之低温测试系统
摘要
一种低温测试系统,用以在低温状态下测试积体电路元件。本创作之低温测试系统包含一测试座以及一压接装置。压接装置包含一下压治具、一液体导管以及一热传导元件。一低温液体流经液体导管,并与热传导元件进行热交换,致使下压治具保持在恒定低温状态。置于测试座上之积体电路元件在下压治具压抵及其低温传导下进行测试。
申请公布号
TWM430698
申请公布日期
2012.06.01
申请号
TW101200711
申请日期
2012.01.12
申请人
立卫科技股份有限公司 新竹市新竹科学工业园区力行五路9号
发明人
王振芳;王佑仁
分类号
H01L21/66
主分类号
H01L21/66
代理机构
代理人
陶霖 台北市文山区景兴路202巷8号5楼
主权项
地址
新竹市新竹科学工业园区力行五路9号
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