Semiconductor packages, electronic devices and electronic systems employing the same

摘要

PURPOSE: A semiconductor package, an electronic device, and an electronic system adopting the same are provided to improve durability and reliability of a coupling structure by suppressing cracks in a connection structure which electrically connects a substrate and a semiconductor chip structure. CONSTITUTION: A first lower conductive pattern(115) and a second lower conductive pattern(120) are formed on a first surface of a bottom substrate(105). A first lower insulation layer(135) has a first lower opening(139) and a second lower opening(154). A first lower connection structure is located on a first lower land region(152). A second lower connection structure is located on a second lower land region(155). A first upper insulation layer(235) has a first upper opening unit(239a,239b) and a second upper opening.