发明名称 METHOD FOR FORMING NITRIDE FILM
摘要 PURPOSE: A method for forming a nitride film is provided to the nitride film on a semiconductor wafer in which high density pattern is formed on the top by using a batch-type vertical plasma-assisted ALD(Atomic Layer Deposition) apparatus. CONSTITUTION: A wafer boat(101) revolves by a rotation mechanism(103) at predetermined rotation speed. A heating mechanism(104) is installed on the outer circumference of a quartz chamber(102). The heating mechanism heats the inside of the quartz chamber at predetermined temperature. Ammonia gas is entered into a plasma space(105) along a flow path(F2) and is entered into a processing container. An exhaust port(107) of the quartz chamber is connected with an exhaust pump.
申请公布号 KR20120075386(A) 申请公布日期 2012.07.06
申请号 KR20110141169 申请日期 2011.12.23
申请人 ELPIDA MEMORY, INC.;TOKYO ELECTRON LIMITED 发明人 FUJII MOTOKI;MATSUNAGA MASANOBU;YAMAMOTO KAZUYA;UMEZAWA KOTA
分类号 H01L21/318 主分类号 H01L21/318
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