发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for manufacturing a semiconductor device is provided to form a semiconductor device with multilayer step profile through a photolithography and an etching process. CONSTITUTION: A stack structure is formed by alternately laminating a plurality of insulating films(20) and conductive films(30) on a substrate(10). The insulating film includes a first insulating film(21), a second insulating film(22), and a third insulating film(23). The conductive film includes a first conductive film(31), a second conductive film(32), and a third conductive film(33). A first photoresist pattern is formed on the stack structure. A second photoresist pattern(43) is formed by thermally processing the first photoresist pattern. |
申请公布号 |
KR20120075037(A) |
申请公布日期 |
2012.07.06 |
申请号 |
KR20100137056 |
申请日期 |
2010.12.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JOON SUNG;SHIN, HYE SOO;KIM, MI YOUN;KIM, YOUNG SOO |
分类号 |
H01L21/8247;H01L27/115 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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