发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for manufacturing a semiconductor device is provided to form a semiconductor device with multilayer step profile through a photolithography and an etching process. CONSTITUTION: A stack structure is formed by alternately laminating a plurality of insulating films(20) and conductive films(30) on a substrate(10). The insulating film includes a first insulating film(21), a second insulating film(22), and a third insulating film(23). The conductive film includes a first conductive film(31), a second conductive film(32), and a third conductive film(33). A first photoresist pattern is formed on the stack structure. A second photoresist pattern(43) is formed by thermally processing the first photoresist pattern.
申请公布号 KR20120075037(A) 申请公布日期 2012.07.06
申请号 KR20100137056 申请日期 2010.12.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JOON SUNG;SHIN, HYE SOO;KIM, MI YOUN;KIM, YOUNG SOO
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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