发明名称 ARCHITECTURE FOR A 3D MEMORY ARRAY
摘要 <p>PURPOSE: A 3D memory array structure is provided to compensate the change of a threshold voltage between memory cells in an array by applying different bias conditions to a selected bit line. CONSTITUTION: An integrated circuit device includes a memory array(160) and a bias circuit. A bias circuit compensates the change of a threshold voltage corresponding to a memory state of a memory cell in an array by applying different bias conditions to the selected bit line. A row decoder(161) is connected to a plurality of word lines(162) which are arranged along a row in a memory array. A column decoder is connected to one set of page buffers(163) through a data bus.</p>
申请公布号 KR20120084268(A) 申请公布日期 2012.07.27
申请号 KR20120005598 申请日期 2012.01.18
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 HUNG CHUN HSIUNG;HUNG SHUO NAN;HUNG JI YU;HUANG SHIN LIN;WANG FU TSANG
分类号 G11C16/24;G11C16/30;H01L21/8247;H01L27/115 主分类号 G11C16/24
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