发明名称 |
ARCHITECTURE FOR A 3D MEMORY ARRAY |
摘要 |
<p>PURPOSE: A 3D memory array structure is provided to compensate the change of a threshold voltage between memory cells in an array by applying different bias conditions to a selected bit line. CONSTITUTION: An integrated circuit device includes a memory array(160) and a bias circuit. A bias circuit compensates the change of a threshold voltage corresponding to a memory state of a memory cell in an array by applying different bias conditions to the selected bit line. A row decoder(161) is connected to a plurality of word lines(162) which are arranged along a row in a memory array. A column decoder is connected to one set of page buffers(163) through a data bus.</p> |
申请公布号 |
KR20120084268(A) |
申请公布日期 |
2012.07.27 |
申请号 |
KR20120005598 |
申请日期 |
2012.01.18 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
HUNG CHUN HSIUNG;HUNG SHUO NAN;HUNG JI YU;HUANG SHIN LIN;WANG FU TSANG |
分类号 |
G11C16/24;G11C16/30;H01L21/8247;H01L27/115 |
主分类号 |
G11C16/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|