| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in preservation stability, and capable of providing sufficient connection reliability even in the case where flip-chip connection is carried out by a previous feed system. <P>SOLUTION: The epoxy resin composition 6 for sealing and filling a semiconductor includes an epoxy resin, an acid anhydride, a curing promoter and a flux agent, wherein the curing promoter is an organic acid addition of imidazoles. The organic acid is at least one selected from the group consisting of isocyanuric acid, an aromatic carboxylic acid and a Lewis acid. <P>COPYRIGHT: (C)2012,JPO&INPIT |
