发明名称 |
SINGLE OR MULTI-LAYER PRINTED CIRCUIT BOARD WITH RECESSED OR EXTENDED BREAKAWAY TABS AND METHOD OF MANUFACTURE THEREOF |
摘要 |
Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly. |
申请公布号 |
HK1081380(A1) |
申请公布日期 |
2012.09.14 |
申请号 |
HK20060100955 |
申请日期 |
2006.01.20 |
申请人 |
PPG INDUSTRIES OHIO INC. |
发明人 |
ALAN E. WANG E.;KEVIN C. OLSON C.;THOMAS H. DI STEFANO H. |
分类号 |
H05K;H05K1/05;H05K3/00;H05K3/06;H05K3/44;H05K3/46 |
主分类号 |
H05K |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|