| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which excels in moldability, in which the thermal conductivity is high when being made to be a composite with an inorganic filler, and which gives a molding which has low thermal expansibility and excellent in heat resistance, and to provide a molding using the same. <P>SOLUTION: The epoxy resin composition includes: an epoxy resin; a curing agent; and an inorganic filler as principal components, wherein as the epoxy resin component, the epoxy resin having an amide group is used by at least 50 wt.% in the epoxy resin component, and as the curing agent component, a bifunctional phenolic compound is used by at least 50 wt.% in the curing agent component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
