ADHESION STRUCTURE AND THERMOELECTRIC MODULE HAVING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a simple structure which ensures to increase the thickness of an adhesive.

SOLUTION: An adhesive structure has: a spacer (a first member) 5; a first substrate (a second member) 3; and an adhesive 11 bonding the spacer 5 to the first substrate 3. The spacer 5 has a contact surface 5b1 contacting with the first substrate 3, a step part 5j forming a step with the contact surface 5b1 in a direction that moves away from the first substrate 3 relative to the contact surface 5b1; and an adhesive surface 5c1 connected with the contact surface 5b1 by the step part 5j and receiving the adhesive 11 filling a space between itself and the first substrate 3.

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