FLEXIBLE DEVICE MANUFACTURING METHOD AND FLEXIBLE DEVICE

摘要

This method of manufacturing a flexible device (5) involves forming a release layer (2) by coating and firing a prescribed solution on a support body (1) having hydroxyl groups on the surface, forming a flexible substrate (3) and a device (4) on the release layer (2), and releasing the release layer (2), the flexible substrate (3) and the device (4) from the support body (1) at the border between the support body (1) and the release layer (2), wherein the ratio of silicon atoms contained in alkylsilane alkoxide derivatives in the prescribed solution and titanium atoms contained in titanium alkoxide derivatives is 3.3-4.1:1 if the firing temperature in the second step is greater than or equal to 200°C and less than 270°C, is 3.3-23:1 if the firing temperature is 270-330°C, and is 19-23:1 if the firing temperature exceeds 330°C and is less than or equal to 350°C.