| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem of a mounting structure where a semiconductor element and a lead are connected using a metal connection plate that variation in the amount of solder supply increases or the amount of solder supply is difficult to be controlled when using a method of supplying solder onto the electrode of a semiconductor element being bonded to the metal connection plate for each unit, or onto the connection of the leads. <P>SOLUTION: The manufacturing method of a semiconductor device includes a step for preparing a metal connection plate 16A having, at both ends thereof, the bonding parts each connected with the connection 26 of a semiconductor element 12 and a lead 20, and provided with a conductive bonding layer 41, 42 on one principal surface, a step for mounting the semiconductor element 12 on one principal surface of an island 14 via a bonding material 28, and a step for bonding the metal connection plate 16A by superposing the conductive bonding layers 41, 42 on the electrode 31 of the semiconductor element 12 and on the connection 26 of the lead 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
