SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR PRODUCING SAME, AND METHOD OF BONDING ELECTRONIC COMPONENT

摘要

Disclosed is a sinterable bonding material which is a liquid or a paste containing copper nanoparticles having a particle diameter of 1,000 nm or less, in which the copper nanoparticles have one or more particle diameter peaks of a number-based grain size distribution within a class of particle diameter of 1 to 35 nm and within a class of particle diameter of more than 35 nm and 1,000 nm or less respectively, and in which the copper nanoparticles include individual particles (primary particles) and secondary particles, each of the secondary particles being a fused body of the primary particles. Thus, oxidation resistance and bondability are made compatible in a sinterable bonding material using copper nanoparticles, and ion migration is suppressed in a bonded portion of a semiconductor device, etc. manufactured by using the sinterable bonding material.