| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component on which semiconductor elements are mounted on a circuit board, and which effectively absorbs stress to be applied from the circuit board to the semiconductor elements while maintaining contact connection between the circuit board and the semiconductor elements, and to provide a method of manufacturing the same. SOLUTION: The electronic component includes: a circuit board 30 in which connecting electrodes 32 are formed on one surface side; semiconductor elements 10 electrically formed on the circuit board 30 and connected to the connecting electrodes 32 via protruding shaped terminals 22 having elasticity; and an insulative filler which is filled between the circuit board 30 and the semiconductor elements 10, is solid at ordinary temperatures, and performs phase-change to a liquid state or a gelatinous state by application of heat. COPYRIGHT: (C)2010,JPO&INPIT |
