Method for Fabricating Array-Molded Package-on-Package

摘要

a An improved semiconductor device package is manufactured by attaching semiconductor chips (130) on an insulating substrate (101) having contact pads (103). A mold is provided, which has a top portion (210) with metal protrusions (202) at locations matching the pad locations. The protrusions are shaped as truncated cones. The substrate and the chips are loaded onto the bottom mold portion (310); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions approach the contact pads. Encapsulation compound is introduced into the cavity and the protrusions create apertures through the encapsulation compound towards the pad locations.