发明名称 |
Integrated circuit packaging system with lead encapsulation and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.
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申请公布号 |
US8519518(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US20100890409 |
申请日期 |
2010.09.24 |
申请人 |
DO BYUNG TAI;PAGAILA REZA ARGENTY;CHUA LINDA PEI EE;TRASPORTO ARNEL SENOSA;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;PAGAILA REZA ARGENTY;CHUA LINDA PEI EE;TRASPORTO ARNEL SENOSA |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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