| 摘要 |
Since a second molding surface 103a is separated from the second mold 42 before a first molding surface 102a is completely separated from the first mold 41, in a state difficult to take the unbalanced force, the separating force is applied at the same time on the first and the second molding surfaces 102a and 103a of the substrate 101, it is possible to prevent damage to the substrate 101 at the time of mold release even if the substrate 101 is comparatively thin. Since the mold release is performed with unseparated portions remaining on each of the first and the second molding surfaces 102a and 103a, it is unnecessary to separately provide a step of protecting a first and a second optical surfaces 11d and 12d on the opposite side during the mold release, whereby a precise wafer lens 100 can be produced simply and efficiently.
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