发明名称 Structural Assembly for Cold Plate Cooling
摘要 A device including a structural member having a heat spreader and an electronic device mounted directly to a first surface of the heat spreader of the structural member. The device also includes a cold plate mounted directly to the first surface of the heat spreader of the structural member.
申请公布号 US2013250519(A1) 申请公布日期 2013.09.26
申请号 US201213429691 申请日期 2012.03.26
申请人 ZAFFETTI MARK A.;TADDEY EDMUND P.;HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC. 发明人 ZAFFETTI MARK A.;TADDEY EDMUND P.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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