| 摘要 |
<p>External electrodes (3b) are formed to cover both the end portions of a ceramic element (1), and on each of the surfaces of the external electrodes (3b), a first film (4b) having Ni as a main component, and a second film (5b) composed of Sn, solder or the like are formed. Each of the external electrodes (3b) has an end surface portion (6b) and a folded back side surface portion (8b). In a region having a linear distance (L) of at least 5 mum in the direction from the cover end portion (7b) of the folded back side surface portion (8b) to the end surface portion (6b), each of the external electrodes (3b) has a glass layer (9) containing at least Si formed therein in contact with the ceramic element (1). The average thickness (t) of the glass layer (9) is 3-10 mum, and the content of the Si component in the glass layer (9) is equal to or more than 11 weight % (but preferably equal to or less than 40 weight %). Consequently, even if the external electrodes are plated, elusion of the ceramic element can be suppressed, and a ceramic electronic component having excellent mechanical strength is provided.</p> |
