凸块接垫结构,申请号TW100144118-传众专利搜索

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发明名称	凸块接垫结构
摘要
申请公布号	TWI421988	申请公布日期	2014.01.01
申请号	TW100144118	申请日期	2011.12.01
申请人	联发科技股份有限公司新竹市新竹科学工业园区笃行一路1号	发明人	杨明宗;黄裕华
分类号	H01L23/482	主分类号	H01L23/482
代理机构		代理人	洪澄文台北市南港区三重路19之6号2楼;颜锦顺台北市南港区三重路19之6号2楼
主权项
地址	新竹市新竹科学工业园区笃行一路1号

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