发明名称 |
METHOD FOR PRODUCING THE SAME |
摘要 |
A method for producing a semiconductor device includes solder-connecting a semiconductor chip, onto an insulating substrate including a ceramic board and having conductor layers on two surfaces thereof, with a lead-free solder; warping a radiating base such that a surface of the radiating base on a side opposite to the insulating substrate is convex; and solder-connecting the insulating substrate onto the warped radiating base with the lead-free solder so as to provide a substantially flat solder-connected radiating base. |
申请公布号 |
US2014080262(A1) |
申请公布日期 |
2014.03.20 |
申请号 |
US201314016754 |
申请日期 |
2013.09.03 |
申请人 |
NISHIMURA YOSHITAKA;MOROZUMI AKIRA;OHNISHI KAZUNAGA;MOCHIZUKI EIJI;TAKAHASHI YOSHIKAZU;FUJI ELECTRIC CO., LTD. |
发明人 |
NISHIMURA YOSHITAKA;MOROZUMI AKIRA;OHNISHI KAZUNAGA;MOCHIZUKI EIJI;TAKAHASHI YOSHIKAZU |
分类号 |
H01L23/00;H01L23/34 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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