发明名称 |
Base Film and Pressure-Sensitive Adhesive Sheet Provided Therewith |
摘要 |
To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin. |
申请公布号 |
US2014079947(A1) |
申请公布日期 |
2014.03.20 |
申请号 |
US201214005574 |
申请日期 |
2012.03.22 |
申请人 |
TAMURA KAZUYUKI;AKUTSU TAKASHI;ETO YUKI;HUKUZAKI TOMOHIDE;ARAKAWA CHEMICAL INDUSTRIES, LTD.;LINTEC CORPORATION |
发明人 |
TAMURA KAZUYUKI;AKUTSU TAKASHI;ETO YUKI;HUKUZAKI TOMOHIDE |
分类号 |
H01L23/00;C09J7/02 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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