发明名称 |
Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition |
摘要 |
A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition. |
申请公布号 |
US8679724(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US20060636482 |
申请日期 |
2006.12.11 |
申请人 |
KANDA HIROMI;KANNA SHINICHI;FUJIFILM CORPORATION |
发明人 |
KANDA HIROMI;KANNA SHINICHI |
分类号 |
G03F7/039;G03F7/20;G03F7/30 |
主分类号 |
G03F7/039 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|