发明名称 Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
摘要 A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.
申请公布号 US8679724(B2) 申请公布日期 2014.03.25
申请号 US20060636482 申请日期 2006.12.11
申请人 KANDA HIROMI;KANNA SHINICHI;FUJIFILM CORPORATION 发明人 KANDA HIROMI;KANNA SHINICHI
分类号 G03F7/039;G03F7/20;G03F7/30 主分类号 G03F7/039
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