发明名称 MULTILAYER ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a multilayer electronic component in which contact characteristics are excellent between an internal electrode and a terminal electrode, and crack failure of the element body can be reduced while ensuring excellent thermal shock characteristics.SOLUTION: A multilayer electronic component includes an element body 4 in which a plurality of internal electrode layers 12, 13 are formed to face each other via a ceramic layer 10, and terminal electrodes 6, 8 provided on the side end faces 5, 7 of the element body 4. A predetermined gap 24 is formed between the terminal electrodes 6, 8 and the side end faces 5, 7, and leads 22, 23 projecting from the side end face through the gap 24 and being connected with the terminal electrodes 6, 8 are formed integrally with the internal electrode layers. At the distal ends of a protrusion 26 protruding from the side end faces of the leads 22, 23, thick wall portions 28 thicker than the leads 22, 23 are formed while being buried in the terminal electrodes 6, 8.
申请公布号 JP2014060331(A) 申请公布日期 2014.04.03
申请号 JP20120205701 申请日期 2012.09.19
申请人 TDK CORP 发明人 FUJIMURA TOMOYOSHI
分类号 H01G4/232;H01G4/30 主分类号 H01G4/232
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