| 摘要 |
The present invention relates to an apparatus for removing and mounting an electronic tag, and more specifically, to an electronic tag removing and mounting apparatus that may sequentially perform removing the electronic tag from a protection film and mounting the removed electronic tag onm a PCB substrate through a series of processes to thus prevent damage to the electronic tag and to increase accuracy of mounting the tag. According to the present invention, the electronic tag removing and mounting apparatus includes an X-axis rail provided along an X-axis, a Y-axis rail provided to cross a lower portion of a side of the X-axis rail, a magazine unit receiving a work consisting of the electronic tag and the protection film, a vacuum sucking shuttle unit that moves forwards and backwards along the X-axis rail to vacuum-suck and carry the work, a centering unit that aligns the work carried from the magazine unit, a removing unit removing the protection film from the work carried from the centering unit, and a vacuum sucking mounting unit that moves forwards and backwards along the X-axis rail and carries the protection film-removed electronic tag from the removing unit to the Y-axis rail and mounts the electronic tag on a PCB substrate on the Y-axis rail. |
