发明名称 |
PRINTED WIRING BOARD |
摘要 |
An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a printed wiring board including: an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer. A substrate is embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is. The insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer. A ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five. |
申请公布号 |
US2014158406(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
US201214232595 |
申请日期 |
2012.07.19 |
申请人 |
Kato Hiroaki;Komori Kiyotaka |
发明人 |
Kato Hiroaki;Komori Kiyotaka |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
1. A printed wiring board comprising:
an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer, wherein: the insulating layer is provided with a substrate embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is; the insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer; the thick layer is positioned on a side of the substrate over which the signal layer is provided; the thin layer is positioned on an opposite side of the substrate from the side over which the signal layer is provided; and a ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.
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地址 |
Osaka JP |