| 摘要 |
PROBLEM TO BE SOLVED: To suppress warpage of a multi-layer ceramic substrate during sintering.SOLUTION: A multi-layer ceramic substrate includes: a plurality of insulating layers laminated; at least one wiring layer provided in at least one of at least one first interlayer in the plurality of insulating layers and an external surface facing in a laminating direction of the plurality of insulating layers laminated among external surfaces of the plurality of insulating layers, and forming wiring; at least one through conductor; and a dummy layer formed by sintering a material having a sintering shrinkage rate higher than that of the wiring layer, provided in a second interlayer different from the first interlayer provided with the wiring layer among interlayers in the plurality of insulating layers, and electrically isolated from the wiring layer and the through conductor. The multi-layer ceramic substrate is equally divided into two regions according to a thickness in the laminating direction. The dummy layer exists in the region in which the total volume of the wiring layer is smaller, of the two regions. |
