发明名称 FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHOD, AND POLISHING DEVICE EQUIPPED WITH FILM THICKNESS MEASUREMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a film thickness measurement device and a film thickness measurement method which can improve an accuracy of measurement of a film thickness.SOLUTION: A film thickness measurement device comprises: a substrate stage 87 for horizontally supporting a substrate W; a rinse water feed section 90 for feeding rinse water onto the entire surface of the substrate W on the substrate stage 87; a film thickness measurement head 84 which radiates light onto a measurement area on the surface of the substrate W on the substrate stage 87, creates spectrum of light reflected from the measurement area, and determines a film thickness of the substrate W on the basis of said spectrum; and a gas injection part 130 which forms a jet stream of a gas on an optical path of light and applies said jet stream of the gas onto the measurement area.
申请公布号 JP2015016540(A) 申请公布日期 2015.01.29
申请号 JP20130147089 申请日期 2013.07.12
申请人 EBARA CORP 发明人 NOMURA SUEKAZU;IIIZUMI TAKESHI;WATANABE KAZUHIDE;KOBAYASHI YOICHI
分类号 B24B49/12;B24B37/34;B24B49/04;G01B11/06;H01L21/304 主分类号 B24B49/12
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