发明名称 |
FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHOD, AND POLISHING DEVICE EQUIPPED WITH FILM THICKNESS MEASUREMENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a film thickness measurement device and a film thickness measurement method which can improve an accuracy of measurement of a film thickness.SOLUTION: A film thickness measurement device comprises: a substrate stage 87 for horizontally supporting a substrate W; a rinse water feed section 90 for feeding rinse water onto the entire surface of the substrate W on the substrate stage 87; a film thickness measurement head 84 which radiates light onto a measurement area on the surface of the substrate W on the substrate stage 87, creates spectrum of light reflected from the measurement area, and determines a film thickness of the substrate W on the basis of said spectrum; and a gas injection part 130 which forms a jet stream of a gas on an optical path of light and applies said jet stream of the gas onto the measurement area. |
申请公布号 |
JP2015016540(A) |
申请公布日期 |
2015.01.29 |
申请号 |
JP20130147089 |
申请日期 |
2013.07.12 |
申请人 |
EBARA CORP |
发明人 |
NOMURA SUEKAZU;IIIZUMI TAKESHI;WATANABE KAZUHIDE;KOBAYASHI YOICHI |
分类号 |
B24B49/12;B24B37/34;B24B49/04;G01B11/06;H01L21/304 |
主分类号 |
B24B49/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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