| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method of a plated circuit which is resistant to temperature change and can be manufactured with high efficiency.SOLUTION: A manufacturing method of a plated circuit comprises: arranging a connection part 28s of a tabular beam lead 28 (connection member) which connects a plurality of patterns (22a, 22b) in a ceramic substrate 22 with each other and has conductivity, and connection parts (26as, 26bs) of a plurality of chip elements (26a, 26b) soldered on the ceramic substrate 22 (substrate) in a line on the ceramic substrate 22 (substrate); and connecting a plurality of connection wires 30 (30a, 30b, 30c, 30d) by bonding. |
