| 发明名称 |
THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE WITH CURING FILM, AND ELECTRONIC COMPONENT |
| 摘要 |
The present invention pertains to a thermosetting resin composition, a cured film, a substrate with a cured film, and an electronic component, said thermosetting resin composition containing a poly(ester amide) acid (A), an epoxy compound having a fluorene skeleton (B), and an epoxy curing agent (C). |
| 申请公布号 |
WO2015012395(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
WO2014JP69722 |
申请日期 |
2014.07.25 |
| 申请人 |
JNC CORPORATION |
发明人 |
FURUTA, TOMOTSUGU;MOROKOSHI, SHINTA;KIKUCHI, AYAKO |
| 分类号 |
C08L63/00;C08G59/42;C08K5/09;C08L79/08;H05K1/03;H05K3/28 |
主分类号 |
C08L63/00 |
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