发明名称 FOAMABLE COMPOSITION WITH REDUCED THERMAL CONDUCTIVITY FOR USE IN PLASTIC PROFILES
摘要 Foamable composition comprises (a) at least one base polymer, (b) at least one propellant, and (c) at least one lubricant and/or at least one heat stabilizer. Independent claims are also included for: (1) a polymer foam obtainable by expanding the above composition, exhibiting a thermal conductivity of less than 0.04 W/(mK), an expansion of >= 1000%, preferably >= 2000%, and/or a weldability of 80 seconds at 240-260[deg] C; (2) a foam-filled hollow body in the form of a window- or door frame, comprising at least one cavity, which is filled with the above polymer foam; and (3) producing the foam-filled hollow body, comprising introducing the composition into at least one cavity of the hollow body during extrusion of the hollow body, and foaming.
申请公布号 EP2828055(A1) 申请公布日期 2015.01.28
申请号 EP20130708500 申请日期 2013.03.12
申请人 SIKA TECHNOLOGY AG 发明人 ACKERMANN, HERBERT;HOEFFLIN, FRANK;BRUNNER, ANDREAS
分类号 B29C44/24;B29C47/38;B29C47/56;B29K23/00;B29K25/00;B29K27/06;B29L31/00;C08J9/00;C08J9/08;C08J9/10 主分类号 B29C44/24
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