| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination structure body and a lamination unit, being suitable in miniaturizing, with assembling being easy.SOLUTION: There are stacked a semiconductor module and a cooling pipe which is stacked on the semiconductor module for cooling the semiconductor module alternately, and the cooling pipe is disposed on both surfaces of the semiconductor module in stacking direction. The cooling pipe includes an exterior body of which a portion contacting to the semiconductor module is plate-like, a partitioning plate for dividing an internal space surrounded by the exterior body in two regions along stacking direction, and two spring members which are provided to the two regions with a load in stacking direction. The spring member includes a plate-like base part which is abutted with or jointed to the exterior body, and a plurality of extension parts each of which rises from the base part and extends on the same main side as the base part, with a tip end contacting to the partitioning plate for generating a load. |
