| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board which simplifies the process and thereby achieves low costs.SOLUTION: A manufacturing method of a printed wiring board 1 having a wiring pattern 20 includes: a first step S10, S20 where a seed layer 21 is selectively formed on an insulative substrate 10; and a second step S30 where a conductor layer 22 is formed on the seed layer 21 by electrolytic plating. The seed layer 21 has a shape corresponding to the wiring pattern 20.</p> |
