| 发明名称 |
CIRCUIT BOARD AND MANUFACTURING METHOD FOR CIRCUIT BOARD |
| 摘要 |
<p>A circuit board (20) onto which an electronic component is to be mounted is provided with insulating core substrates (40 60) and patterned metal sheets. The metal sheets (50 70) are bonded to at least one surface of the insulating core substrates (40 60). The insulating core substrates (40 60) and the metal sheets (50 70) form a layered body (S1) in which a gas venting hole is provided. The gas venting hole is formed so that when the electronic component (80) is mounted the gas present between the insulating core substrates (40 60) and the metal sheets (50 70) expands and is released to the open air side via the gas venting hole.</p> |
| 申请公布号 |
IN763CHN2014(A) |
申请公布日期 |
2015.04.03 |
| 申请号 |
IN2014CH00763 |
申请日期 |
2014.01.30 |
| 申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI |
发明人 |
ASANO HIROAKI;KOIKE YASUHIRO;OZAKI KIMINORI;SHIMADU HITOSHI;FURUTA TETSUYA;MIYAKE MASAO;HAYAKAWA TAKAHIRO;ASAI TOMOAKI;YAMAUCHI RYOU |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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