| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor element housing package capable of reducing breakage of a translucent member.SOLUTION: An optical semiconductor element housing package includes a substrate containing a mounting region on which an optical semiconductor element is mounted, a frame body which is disposed on the substrate so as to surround the mounting region, a lid body which is jointed on an upper surface of the frame body and contains an opening part overlapping with the mounting region, a first ring member which is disposed on an upper surface of the lid body and is positioned along an outer periphery of the opening part, and a translucent member which is positioned to overlap with the opening part, being jointed on an upper surface of the lid body through the first ring member. On a lower surface of the lid body, a second ring member positioned to overlap with the first ring member is disposed. |
