发明名称 METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM, AND SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a patterned cured film which is excellent in heat resistance and mechanical characteristics and in which the cross-sectional shape of a pattern is smooth, a patterned cured film obtained by the production method, and a semiconductor element having the patterned cured film.SOLUTION: The method for producing a patterned cured film includes: a step of applying a resin composition containing (a) a polybenzoxazole precursor, (b) a photosensitive agent, (c) a crosslinking agent, and (d) a solvent onto a substrate to form a resin film; a step of exposing and developing the resin film to form a patterned resin film; a first heating step of heating the patterned resin film at 100-140°C; and a second heating step of further heating the patterned resin film at 200-400°C.
申请公布号 JP2015064526(A) 申请公布日期 2015.04.09
申请号 JP20130199370 申请日期 2013.09.26
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 SATO KINATSU;KOIBUCHI YUKARI
分类号 G03F7/40;C08G69/26;G03F7/004;G03F7/023;H01L21/027 主分类号 G03F7/40
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