发明名称 MANUFACTURING METHOD OF SILICON CARBIDE EPITAXIAL SUBSTRATE, SUBSTRATE BEARING MEMBER, AND SILICON CARBIDE SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a silicon carbide epitaxial substrate having reduced crystal defect, a substrate bearing member used for the manufacturing method of the silicon carbide epitaxial substrate, and a silicon carbide semiconductor manufacturing device. ! SOLUTION: The manufacturing method of the silicon carbide epitaxial substrate includes a step (S10) for preparing a base substrate, a step (S20) for discharging the base substrate in the insulated state, and a step (S30) for epitaxially growing silicon carbide on the discharged base substrate after the discharging step (S20). ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015101503(A) 申请公布日期 2015.06.04
申请号 JP20130242793 申请日期 2013.11.25
申请人 SUMITOMO ELECTRIC IND LTD 发明人 ITO SATOMI ; TAMASO HIDETO ; GENBAN JUN
分类号 C30B29/36;C23C16/02;C23C16/42;C23C16/458;H01L21/205 主分类号 C30B29/36
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