METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

To provide a semiconductor device having improved reliability.;A semiconductor chip is conveyed onto a chip mounting region of a wiring board by means of a bonding jig to electrically couple the semiconductor chip and the wiring board to each other. The bonding jig for mounting the semiconductor chip on the wiring board is equipped with a retention portion for adsorbing and retaining a logic chip, a pressing portion for pressing against the back surface of the semiconductor chip, and a sealing portion to be firmly attached to the peripheral edge portion of the back surface of the semiconductor chip. The surface of the sealing portion to be firmly attached to the back surface of the semiconductor chip is made of a resin.

主权项

1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) providing a wiring board having a chip mounting surface, a plurality of terminals formed over the chip mounting surface, and a packaging surface over a side opposite to the chip mounting surface; (b) placing a first adhesive material over the chip mounting surface of the wiring board; and (c) after the step (b), mounting a first semiconductor chip having a first surface, a plurality of first surface electrodes exposed from the first surface, a plurality of first bump electrodes bonded to the plurality of the first surface electrodes, respectively, and a first back surface on the side opposite to the first surface over the chip mounting surface of the wiring board via the first adhesive material so that the first surface of the first semiconductor chip faces to the chip mounting surface of the wiring board and thereby electrically coupling the terminals and the first surface electrodes to each other; wherein the step (c) comprises the steps of: (c1) conveying the first semiconductor chip to over the first adhesive material while adsorbing and retaining the first back surface of the first semiconductor chip by means of a bonding jig; and (c2) heating the first semiconductor chip from a side of the first back surface thereof by means of the bonding jig and pressing the bonding jig against the first semiconductor chip from the side of the first back surface thereof to electrically couple the terminals and the first surface electrodes to each other; wherein the bonding jig has a retention portion for adsorbing and retaining the first semiconductor chip therewith, a pressing portion for pressing against the first back surface of the first semiconductor chip in the step (c2), and a sealing portion to be firmly attached to a peripheral edge portion of the first back surface of the first semiconductor chip, and wherein a first surface of the sealing portion facing to the first back surface of the first semiconductor chip has a resin.